Product Center
LED&Semiconductor Industry
Specifications：
Model 966 – 8" | Model 966 – 12" | |
Max. wafer size | Ø 200 mm* | Ø 300 mm* |
Max. tape width | 300 mm | 400 mm |
Plate heating | 到 80°C | 到 80°C |
Machine dimensions(WxDxH) | 304 x 800 x 394 mm | 330 x 1000 x 560 mm |
Approx. machine weight | 30 kg | 60 kg |
Features：
• Uniform mounting without air bubbles
• Build-in reeling and removal of UV tape backing
• Mounting plate temperature control
• Compatibility with all film frames; linear and circular tape cutting
• Custom-made chucks for special requirements:
• Thin wafers
• Sensitive surface
• Multiple panels
• Options:
*ESD protection
*Tape saving mechanism
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Address: 13A Weswick Commercial Building, No.147 Queen's Road East, Wanchai, Hong Kong
Telephone:+852 28662978
Fax:+852 28662013
Email:admin@bb-technology.com.hk
Xiamen Office
Telephone:+86 (592) 5083007/5083006
Taiwan Office
Telephone:+886-2-77253668
Hong Kong Headquarters
Address: 13A Weswick Commercial Building, No.147 Queen's Road East, Wanchai, Hong Kong
Telephone:+852 28662978
Fax:+852 28662013
Email:admin@bb-technology.com.hk
Xiamen Office
Telephone:+86 (592) 5083007/5083006
Taiwan Office
Telephone:+886-2-77253668
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